Analytical Models of Passive Linear Structures in Printed Circuit Boards
نویسندگان
چکیده
Analytical models for passive linear structures, like metallic traces, vias, are proposed simulations at the package and Printed circuit board (PCB) levels. In method, traces modeled based on transmission line theory, whereas vias described by parallel-plate impedance several equivalent circuits elements. The can be applied to efficiently simulate composed structures. Several scenarios analyzed including with two or three width, routed into different layers interconnects commonly used in PCBs. results of compared those from full-wave experiments. An improvement computation speed has been observed respect effective range models. our measurements, a compensation approach mismatch parameter measurements is calculated, which could significantly simplify experimental process.
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ژورنال
عنوان ژورنال: Chinese Journal of Electronics
سال: 2021
ISSN: ['1022-4653', '2075-5597']
DOI: https://doi.org/10.1049/cje.2020.08.017